An error occurred with the design of the stage. Due to copper's heat conductivity and the fact that the copper radiation shield is in direct contact with the stage, Helium liquid is exposed to higher temperatures that will cause it to evaporate quicker. A new design is being studied and will soon be posted.
Friday, July 10, 2015
Wednesday, June 3, 2015
Tuesday, June 2, 2015
Project Timeline and Weekly Progress
Week
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Task
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1
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2
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3
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4
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5
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6
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7
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8
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9
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10
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Literature
study
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x
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x
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x
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x
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x
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x
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x
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x
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Mechanical
design
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x
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x
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x
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x
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x
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x
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x
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Electrical
design
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x
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x
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x
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x
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x
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x
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x
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System
integration
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x
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x
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x
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Testing
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x
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Final
report preparation
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x
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x
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.
Week 9
WEEK 9
Interference fit was refuted by the technical adviser. The team resorted to using another method known as silver soldering, to solder the copper stage to the stainless steel rod.
Week 8
WEEK 8
A final design was submitted to the machine shop to produce an Aluminum connector piece. Stage and radiation shield was further being studied and designed due to the accuracy it needs. A slight error might compromise the vacuum to be created around the sample. The team also decided how the stage is going to be attached to the stainless-steel rod. Instead of soldering, the team has decided to join the stage to the aluminum rod through interference fit
Week 7
WEEK 7
A final design of the connector was submitted to be 3-D printed to get a proto-type. Screw holes positions needed to be adjusted so that two screws on different sides of the connector do not intersect
Week 6
WEEK 6
The stage was the team main concern. A design, limited by less an inch in width, needed further studying to apply vacuum sealing. Small details, including but not limited to, screws, electrical feed-throughs, heater, thermometers, were also researched to find the best fit for the project.
Week 5
WEEK 5
Measurements were taken for a model connector used for a cryo-stat's dipping probe. A similar, more compatible version, was designed for a Dewar's dipping probe. Dimensions were slightly different. An additional hole was created for the KF-16 Vacuum fitting.
Week 4
WEEK 4
More research was done on the types of chip sockets and carriers to be used. In addition of studies of vacuum applications.
Week 3
WEEK 3
The team met and discussed the design proposal that was submitted later during the week. The design proposal was refuted and needed alterations due to incompatibility with sealing methods that needed to be considered.
Week 2
WEEK 2
An initial design was submitted to the adviser, which was later refuted due to faulty characteristics of the proposed probe. The proposed probe lacked the ability to load several samples due to a wrong decision with respect to the chip carrier used for the design. The team overlooked the request of the adviser for the use of a heater to stabilize the temperature of the environment. Therefore, more research was needed.
Week 1
WEEK 1
The group was introduced to the product requested by the adviser for cryogenic experiments. The team observed the model probe and were familiarized with the materials that can and cannot be used at low temperatures. The team established an initial idea of how the probe should be designed. The topic of cryogenics was further studied throughout the week.
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