An error occurred with the design of the stage. Due to copper's heat conductivity and the fact that the copper radiation shield is in direct contact with the stage, Helium liquid is exposed to higher temperatures that will cause it to evaporate quicker. A new design is being studied and will soon be posted.
Cryogenic Dipping Probe
Drexel University, Philadelphia, PA 19104
Friday, July 10, 2015
Wednesday, June 3, 2015
Tuesday, June 2, 2015
Project Timeline and Weekly Progress
Week
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Task
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1
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2
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3
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4
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5
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6
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7
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8
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9
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10
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Literature
study
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x
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x
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x
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x
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x
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x
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x
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x
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Mechanical
design
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x
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x
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x
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x
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x
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x
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x
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Electrical
design
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x
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x
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x
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x
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x
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x
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x
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System
integration
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x
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x
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x
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Testing
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x
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Final
report preparation
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x
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x
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.
Week 9
WEEK 9
Interference fit was refuted by the technical adviser. The team resorted to using another method known as silver soldering, to solder the copper stage to the stainless steel rod.
Week 8
WEEK 8
A final design was submitted to the machine shop to produce an Aluminum connector piece. Stage and radiation shield was further being studied and designed due to the accuracy it needs. A slight error might compromise the vacuum to be created around the sample. The team also decided how the stage is going to be attached to the stainless-steel rod. Instead of soldering, the team has decided to join the stage to the aluminum rod through interference fit
Week 7
WEEK 7
A final design of the connector was submitted to be 3-D printed to get a proto-type. Screw holes positions needed to be adjusted so that two screws on different sides of the connector do not intersect
Week 6
WEEK 6
The stage was the team main concern. A design, limited by less an inch in width, needed further studying to apply vacuum sealing. Small details, including but not limited to, screws, electrical feed-throughs, heater, thermometers, were also researched to find the best fit for the project.
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